UROP Research Mentor Project Submission Portal: Submission #1290
Submission information
Submission Number: 1290
Submission ID: 21046
Submission UUID: b62a7e9a-c736-4b8b-86b6-1a1f99f807a5
Submission URI: /urop-research-mentor-project-submission-portal
Submission Update: /urop-research-mentor-project-submission-portal?token=oZDqGF2zLtrmjm7qrY4j3BiiJ4hvRW2jHrdTOSQtax4
Created: Mon, 08/18/2025 - 11:55 PM
Completed: Mon, 08/18/2025 - 11:55 PM
Changed: Tue, 08/26/2025 - 10:28 AM
Remote IP address: 46.110.204.67
Submitted by: Anonymous
Language: English
Is draft: No
Webform: UROP Project Proposal Portal
Submitted to: UROP Research Mentor Project Submission Portal
Research Mentor Information
Yai Pioth Yai Deng
Him
Mr
Graduate Student
Sastry Pamidi
FAMU-FSU College of Engineering
Electrical Engineering
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Additional Research Mentor(s)
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Overall Project Details
Parametric Cryogenic Thermal Model and Mockup System for Thermal Management of Power Electronic System
Active Components, Passive Components, Cooling Elements
Yes
1
Engineering Major
On FSU Main Campus
Innovation Bus to FAMU-FSU Engineering
In-person
8
Flexible schedule (Combination of business and outside of business. TBD between student and research mentor.)
The intention is to design and develop a parametric cryogenic thermal model and a mockup system for thermal management experiments. The objective is to model and experimentally validate thermal behavior in a power electronic system operating at cryogenic temperatures.
A conceptual power electronic system will be designed, consisting of both active and passive components:
• Active Components: MOSFETs, IGBTs, GaNs, Si, SiC, diodes, microcontrollers.
• Passive Components: Capacitors, inductors, resistors, transformers.
• Cooling Elements: Heatsinks, thermal interface materials (TIMs), cryocoolers.
Software Used:
• CAD modeling: SolidWorks / AutoCAD
• Electrical simulation: LTSpice / PLECS
• Thermal analysis: ANSYS Icepak / COMSOL Multiphysics
• Active Components: MOSFETs, IGBTs, GaNs, Si, SiC, diodes, microcontrollers.
• Passive Components: Capacitors, inductors, resistors, transformers.
• Cooling Elements: Heatsinks, thermal interface materials (TIMs), cryocoolers.
Software Used:
• CAD modeling: SolidWorks / AutoCAD
• Electrical simulation: LTSpice / PLECS
• Thermal analysis: ANSYS Icepak / COMSOL Multiphysics
Used of computer and critical thinking
My mentoring philosophy is grounded in fostering a respectful and inclusive environment that values open communication and trust. I support mentees in developing skills, confidence, and a growth mindset to achieve their professional goals while advancing diversity, equity, and inclusion by addressing barriers such as imposter syndrome and accessibility challenges. I tailor my approach to the unique needs, strengths, and aspirations of each individual, and I aim to guide mentees toward independence, integrity, and long-term professional success.
https://scholar.google.com/citations?user=vSjBk_QAAAAJ&hl=en
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- Day: Friday, September 5
Start Time: 7:00
End Time: 7:30
Zoom Link: https://fsu.zoom.us/j/92617199670
UROP Program Elements
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2025
https://cre.fsu.edu/urop-research-mentor-project-submission-portal?token=oZDqGF2zLtrmjm7qrY4j3BiiJ4hvRW2jHrdTOSQtax4