UROP Project
Parametric Cryogenic Thermal Model and Mockup System for Thermal Management of Power Electronic System
Active Components, Passive Components, Cooling Elements
Research Mentor: Mr Yai Pioth Yai Deng, Him
Department, College, Affiliation: Electrical Engineering, FAMU-FSU College of Engineering
Contact Email: yd22@fsu.edu
Research Assistant Supervisor (if different from mentor):
Research Assistant Supervisor Email:
Faculty Collaborators:
Faculty Collaborators Email:
Department, College, Affiliation: Electrical Engineering, FAMU-FSU College of Engineering
Contact Email: yd22@fsu.edu
Research Assistant Supervisor (if different from mentor):
Research Assistant Supervisor Email:
Faculty Collaborators:
Faculty Collaborators Email:
Looking for Research Assistants: Yes
Number of Research Assistants: 1
Relevant Majors: Engineering Major
Project Location: On FSU Main Campus
Research Assistant Transportation Required: Innovation Bus to FAMU-FSU Engineering Remote or In-person: In-person
Approximate Weekly Hours: 8, Flexible schedule (Combination of business and outside of business. TBD between student and research mentor.)
Roundtable Times and Zoom Link:
Number of Research Assistants: 1
Relevant Majors: Engineering Major
Project Location: On FSU Main Campus
Research Assistant Transportation Required: Innovation Bus to FAMU-FSU Engineering Remote or In-person: In-person
Approximate Weekly Hours: 8, Flexible schedule (Combination of business and outside of business. TBD between student and research mentor.)
Roundtable Times and Zoom Link:
- Day: Friday, September 5
Start Time: 7:00
End Time: 7:30
Zoom Link: https://fsu.zoom.us/j/92617199670
Project Description
The intention is to design and develop a parametric cryogenic thermal model and a mockup system for thermal management experiments. The objective is to model and experimentally validate thermal behavior in a power electronic system operating at cryogenic temperatures.Research Tasks: A conceptual power electronic system will be designed, consisting of both active and passive components:
• Active Components: MOSFETs, IGBTs, GaNs, Si, SiC, diodes, microcontrollers.
• Passive Components: Capacitors, inductors, resistors, transformers.
• Cooling Elements: Heatsinks, thermal interface materials (TIMs), cryocoolers.
Software Used:
• CAD modeling: SolidWorks / AutoCAD
• Electrical simulation: LTSpice / PLECS
• Thermal analysis: ANSYS Icepak / COMSOL Multiphysics
Skills that research assistant(s) may need: Used of computer and critical thinking